Analisis Performa Serat Tandan Kosong Kelapa Sawit melalui Pengujian Mekanik dan Termal sebagai Penguat Biokomposit pada Aplikasi Substrat Papan Sirkuit (PCB)

Abstrak

This study aims to evaluate the mechanical, thermal, and auto-ignition properties of Oil Palm Empty Fruit Bunch (OPEFB) fiber-reinforced biocomposites as an alternative substrate material for Printed Circuit Board (PCB). The OPEFB biocomposites were developed through a Systematic Literature Review (SLR) and experimental research using an epoxy resin matrix with variations in fiber volume fraction, fiber length, and fiber orientation. The OPEFB fibers were treated with a 5% sodium hydroxide (NaOH) solution for 2 hours, while the epoxy resin was incorporated with 15 wt.% Ammonium Polyphosphate (APP) as a flame retardant. The biocomposites were fabricated with a thickness of 1.6 mm and tested in accordance with ASTM standards. The results showed maximum values of 30 MPa for tensile strength, 51.55 MPa for flexural strength, 0.695 J/mm² for impact strength, thermal resistance exceeding 250°C, and an auto-ignition temperature of 360°C, indicating their potential as an environmentally friendly alternative PCB substrate material. This study also supports the achievement of Sustainable Development Goal (SDG) 9 and 12, as well as the third Pillar of Conservation through the utilization of OPEFB waste.

Kata kunci

• Ammonium polyphospate
• Biokomposit
• Printed circuit board
• TKS